Influence of Cu Addition and Microstructural Configuration on the Creep Resistance and Mechanical Properties of an Fe-Based α/α′/α″ Superalloy
dc.date.accessioned | 2023-07-28T16:28:58Z | |
dc.date.available | 2023-07-28T16:28:58Z | |
dc.date.issued | 2023-01-14 | |
dc.description.sponsorship | Deutscher Akademischer Austauschdienst (DAAD). Grant Number: 2017/18 Research Grants - Doctoral Programs in Germany; Deutsches Elektronen-Synchrotron. Grant Number: I-20200093; European Research Council. Grant Number: 949626; Deutsche Forschungsgemeinschaft (DFG) | ger |
dc.identifier | doi:10.17170/kobra-202307278514 | |
dc.identifier.uri | http://hdl.handle.net/123456789/14948 | |
dc.language.iso | eng | |
dc.relation.doi | doi:10.1002/adem.202201652 | |
dc.relation.projectid | I-20200093, 949626 | |
dc.rights | Namensnennung-Nicht-kommerziell 4.0 International | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc/4.0/ | * |
dc.subject | creep | eng |
dc.subject | ferritic superalloy | eng |
dc.subject | high-temperature materials | eng |
dc.subject | intermetallics | eng |
dc.subject | transmission electron microscopy | eng |
dc.subject.ddc | 600 | |
dc.subject.ddc | 660 | |
dc.subject.swd | Kupfer | ger |
dc.subject.swd | Nanopartikel | ger |
dc.subject.swd | Superlegierung | ger |
dc.subject.swd | Hochtemperatur | ger |
dc.subject.swd | Intermetallische Verbindungen | ger |
dc.subject.swd | Durchstrahlungselektronenmikroskopie | ger |
dc.subject.swd | Mechanische Eigenschaft | ger |
dc.subject.swd | Kriechen | ger |
dc.title | Influence of Cu Addition and Microstructural Configuration on the Creep Resistance and Mechanical Properties of an Fe-Based α/α′/α″ Superalloy | eng |
dc.type | Aufsatz | |
dc.type.version | publishedVersion | |
dcterms.abstract | Introducing Cu nanoparticles is an effective mechanism for strengthening and toughening Fe-based materials such as ultra-high-strength steels. Herein, the effect of Cu on the mechanical properties of a novel Fe-based α/α′/α″ superalloy is studied. Compared to a Cu-free reference alloy, nanoindentation reveals an increase in hardness, which was associated with the formation of Cu nanoparticles. Both alloys show room temperature (RT) compressive plastic strain at maximum stress greater than 8%, irrespective of the heat-treatment. At RT and at 750 °C, the Cu-containing alloy exhibits a slightly higher strength, but the heat treatment has a more significant impact: A configuration of α-matrix and intermetallic α′/α″-phases forming an interpenetrating network is superior to a state with isolated precipitates. This difference vanishes in monotonic creep experiments, and under the same conditions, the Cu-containing alloy exhibits a twice as high creep rate despite a slightly higher precipitate fraction. This is linked to a higher lattice misfit and faster-coarsening kinetics. Post-mortem transmission electron microscopy analysis of the creep-deformed specimens identifies dislocation bypass as the dominant deformation mechanism. However, the presence of <010>{110} dislocations in the interfacial networks and evidence of dislocation activity within α′/α″ precipitates suggest the occurrence of shearing events. | eng |
dcterms.accessRights | open access | |
dcterms.creator | Morales Victoria, Luis Ángel | |
dcterms.creator | Bezold, Andreas | |
dcterms.creator | Förner, Andreas | |
dcterms.creator | Holz, Hendrik | |
dcterms.creator | Merle, Benoit | |
dcterms.creator | Neumeier, Steffen | |
dcterms.creator | Körner, Carolin | |
dcterms.creator | Zenk, Christopher H. | |
dcterms.source.articlenumber | 2201652 | |
dcterms.source.identifier | eissn:1527-2648 | |
dcterms.source.issue | Issue 9 | |
dcterms.source.journal | Advanced Engineering Materials | eng |
dcterms.source.volume | Volume 25 | |
kup.iskup | false |
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