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dc.date.accessioned2023-01-02T10:52:41Z
dc.date.available2023-01-02T10:52:41Z
dc.date.issued2022-08-20
dc.identifierdoi:10.17170/kobra-202209226890
dc.identifier.urihttp://hdl.handle.net/123456789/14315
dc.description.sponsorshipGefördert im Rahmen des Projekts DEALger
dc.language.isoengeng
dc.rightsNamensnennung 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/*
dc.subject.ddc600
dc.titleA novel approach to construct self-assembled 3D MEMS arrayseng
dc.typeAufsatz
dcterms.abstractThe paper presents the design and technological fabrication process of Yin or Yang-shaped, micron-sized electromechanical system (MEMS) elements displaying asymmetric hollow cylinders with two different curvatures of the cylinder shell. By adapting the process steps, two neighboring shutter MEMS elements can either be attached to each other to create asymmetric hollow cylinders or remain disconnected to form curled cylindrical or ellipsoidal tubes or tube fractions. A novel 3D self-organization process has been developed to connect two neighboring shutter elements, exploiting surface tension forces via a sequential drying process. The process conditions have been analyzed and optimized to fabricate the two different geometries of the MEMS elements. The resulting MEMS system elements were characterized by focused ion beam and scanning electron microscopy. The contribution of Casimir force, van der Waals force, and other physical interfacial forces are discussed in the formation of the asymmetric hollow cylinders.eng
dcterms.accessRightsopen access
dcterms.creatorAkhundzada, Sapida
dcterms.creatorYang, Xiaohui
dcterms.creatorFiedler, Johannes
dcterms.creatorKäkel, Eireen
dcterms.creatorAl-Qargholi, Basim
dcterms.creatorBuhmann, Stefan
dcterms.creatorEhresmann, Arno
dcterms.creatorHillmer, Hartmut
dc.relation.doidoi:10.1007/s00542-022-05361-1
dc.subject.swdMEMSger
dc.subject.swdArrayger
dc.subject.swd3D-Technologieger
dc.subject.swdHohlzylinderger
dc.type.versionpublishedVersion
dcterms.source.identifiereissn:1432-1858
dcterms.source.issueIssue 9
dcterms.source.journalMicrosystem Technologieseng
dcterms.source.pageinfo2139-2146
dcterms.source.volumeVolume 28
kup.iskupfalse


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